Device Packaging 2019

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Core-shell conductive powders for reduced metal content and improved performance in HTCC applications
Keywords: HTCC, core-shell, platinum, palladium
High temperature sensor applications have specific demands for the conductive materials used to construct devices. Traditional materials, such as platinum, palladium, and alloys impart qualities suited to their nature. However, these metals are expensive and alternative materials are generally not suited to the demands of the high temperature sensor devices. This work introduces and compares core-shell materials that impart the desirable qualities of the traditional conductive materials with improved characteristics such as thermal processability and dispersion character through engineered particulate surfaces. Conductive/sensing compositions are synthesized and applied in HTCC applications, such as high temperature oxygen sensors, and compared to traditional materials. Platinum core- shell compositions are presented and shown to reduce metal content in the conductive line structures by up to 30 Wt.% while providing equivalent sensitivity and response to pure platinum sensor compositions. Platinum-palladium alloy core-shell compositions are also introduced and compared to the pure platinum and platinum core-shell application results.
Richard Stephenson, COO
Sunnyvale, CA
United States

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic