Device Packaging 2019

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ULTCC Material for Device Fabrication at 400 oC; An Upgraded Low Cost Fabrication Technology for 5th and 6th Generation Wireless Devices
Keywords: ULTCC, Ceramic-glass, Antenna
The realization of 5th generation telecommunication networks takes place in 2018 onwards and testing and commercialization is predicted to be reached in 2020. The major attractive feature of 5G networks are less than 1 ms latency in overall network by increasing the frequency of operation above WLAN limit (2.4 to 5.9 GHz). Furthermore, the agenda of 6th generation will be integration with 5G, where also cost-effective fabrications along with commercialization are highly required.1,2 This highlights the importance and opportunities of materials and devices with low fabrication temperature processes. Temperature stability of materials properties is one issue of concern when moving towards higher frequencies (above 5 GHz). In addition, energy saving low fabrication temperature (below 500 oC) processes should be met for next generation devices which will remain demanding challenge for 6G3,4. Newly developed ULTCC materials are the first footsteps towards lower ceramics production costs, to improve the stability of materials properties at higher frequency and reduce the CO2 emission to decrease environmental issues. Present paper discusses about existing commercial LTCCs materials and introduces new ceramic-glass composite fabricated at 400 oC based on TiO2 and commercial glass. The composite have good compatibility with Ag and Al electrodes by optimized tape casting, screen-printing, lamination and firing process. In addition, a device level fabrication was demonstrated by developed ULTCC composite material. A dual band patch antenna operated at 2.4 and 5.1 GHz ranges was designed and fabricated to show material feasibility for already existing WLAN applications. Moreover, the properties of realised substrates were also studied at 10 GHz and compared with existing commercial LTCCs. New ULTCC materials have attractive properties and significant energy savings to be utilized as an upgraded solution for upcoming 6th generation targets.
Heli Jantunen, Professor
University of Oulu
Oulu, Oulu

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic