Honeywell

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Cost and Yield Analysis of RDL Creation in Fan-out Wafer Level Packaging
Keywords: RDL, Cost, FOWLP
The fan-out wafer level packaging process continues to be an area of interest and growth for the advanced packaging industry. While cost and yield analyses have already been carried out with a focus on the entire fan-out process, the contribution of redistribution layer (RDL) creation to cost has not been explored in depth. Depending on the details of the fan-out process in question, the creation of one RDL may represent half of the steps that must be carried out when manufacturing a complete fan-out wafer level package. This paper will break down the cost of the activities that make up the entire RDL process. The activities that account for the creation of an RDL include dielectric application, the use of photolithography to define the metal layers, and metallization steps. A typical series of RDL creation steps will be presented, and possible variations to the process will be included. Sensitivity analysis of variables within key steps will be carried out. Additionally, the contribution of an RDL to total package cost in various scenarios will also be evaluated. Activity based cost modeling will be used for the analysis. With this type of cost modeling, a process flow is divided into a series of activities, and the total cost of each activity is accumulated. The cost of each activity is determined by analyzing the following attributes: time required, labor required, material required (consumable and permanent), capital required, and yield loss. The goal of this analysis is to understand which portions of RDL creation contribute significant cost, and how variations in the process may increase or reduce cost. These conclusions will also be applicable to the entire fan-out wafer level packaging process because RDL creation is a significant portion of the total cost of a fan-out package.
Amy Lujan,
SavanSys Solutions LLC
Austin, Texas
USA


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