Here is the abstract you requested from the dpc_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|The Impact of Glass Style and Orientation on the Reliability of SMT Components|
|Keywords: PCB Glass Orinetation, reliability, Impact on components|
|Printed circuit board glass style and orientation can have a significant influence on thermal cycling reliability of surface mount components. DfR is currently performing thermal cycling (-40 to 125C) tests on two PCB glass styles (1080 and 7628). The in plane and out of plane CTE were measured and found to be about 3-4 ppm/C different in the x-y directions of the boards. To facilitate the reliability assessment of SMT component reliability four 0-ohm resistor sizes (2512, 1206, 0602, 0402) were mounted on each board. Each board has 20 resistors with multiple orientations. The overall sample size consists of 32 resistors of each size per glass style. In addition, the PCBs have two pad sizes. The purpose of these experiments is to develop a model for validating fatigue life predictions for different laminate materials. This paper will present the experimental structure, results of the stress tests and variables on the reliability of the chip components and insight into the development of appropriate models.|
|Greg Caswell, Sr. Member of the Technical Staff