Abstract Preview

Here is the abstract you requested from the dpc_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Flux apply, reflow and clean in a single integrated tool
Keywords: solder reflow, flux apply, flux clean
A new and cost effective method to perform solder reflow and post reflow cleaning of water soluble flux is disclosed. The technique, which has been employed, involves industry standard solder ball dropping on pre- deposited flux and subsequent reflow followed by a clean. The method is a single wafer process utilizing a hot plate in an enclosed chamber to control the atmosphere and the position of the wafer with respect to the hot plate to precisely and reproducibly control the temperature profile excursion during the reflow process. After reflow the wafer is placed by a robot on a spin chuck where hot water is used to remove the flux and the wafer is then spin dried.
Gary Hillman,
Montville, New Jersey
United States

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic