Here is the abstract you requested from the dpc_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|High-throughput jetting in micro-device packaging Hanzhuang Liang|
|Keywords: precision coating, jetting, micro-device packaging|
|In a flip chip BGA package, coating and encapsulation materials are applied on the die and the components to protect them from physical stress, contamination, invasion, electrical bridging, etc. Advanced micro-device packaging sets a high and dynamic standard for its supplier industries for speed, precision and flexibility. Manufacturers are being asked to apply protection on more dies in more complicated geometries, in smaller spaces, and to dispense the protection materials during any packaging process. This brings increased challenges for dispensing equipment, such as the ability to match high throughput with upstream pick and place processes in production line while maintaining precision and repeatability. A high-precision and high-throughput jetting process has been developed to match the rate of 5000 components per hour CPH, a speed considered typical for pick and place systems but challenging for precise dispensing. This jetting process is being used for precise coating and encapsulation in flip chip BGA production lines in package applications from consumer electronics to automotive products. Both mechanical and software changes enable the improvements. A well-controlled dual-valve simultaneous design and a continuous dispense path have been applied to achieve high dispensing accuracy at fast speeds. The dispense pattern and route can be modified in the software at no cost, in minutes, and during any step in the design or the assembly stage. Dispensed shapes include dots, lines, rectangle frames and annular rings, with fine edge definition of 50-75um or less. This process can cover a wide range of pattern dimensions between 0.15mm and 100mm. New equipment and processes are under development to further push the limit on higher throughput and precision, increased flexibility, and material dispensability. Key words: precision coating, precision encapsulation, jetting, dispense, micro-device, device packaging, electronics packaging, throughput, repeatability, flexibility|