Here is the abstract you requested from the dpc_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Packaging and Assembly Challenges for Automotive ADAS|
|Keywords: Automotive, ADAS, Sensors|
|New automotive safety features include increased connectivity, improved self-diagnostics, crash avoidance technology, and advanced driver assistance. This translates into increase use of image sensors and radar in a variety of forms. What type of semiconductor packages are used for ADAS and what are the future challenges as new package types are adopted? This presentation discusses some of the opportunities in automotive packaging and the challenges in meeting automotive specifications.|
|Linda Bal, Senior Analyst
TechSearch International, Inc