Honeywell

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Here is the abstract you requested from the dpc_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Comparison of electrical performance between FO WLP and Flip Chip on Coreless Substrate ( FC - CLS ) packages
Keywords: Flip Chip on Coreless, FO WLP, Electrical Performance
FO WLP packages are being offered as a new Package design that would exceed the electrical performance of traditional
Dev Gupta, CTO
APSTL
Scottsdale, AZ
USA


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