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|HIGH-TEMPERATURE THERMAL INTERFACE MATERIALS FOR WIDE-BANDGAP (WBG) APPLICATIONS|
|Keywords: Thermal interface materials, High-temperature packaging, Thermal adhesive film|
|To realize the full potential of WBG semiconductors, high-temperature operation capability is essential – e.g., EVs/HEVs, engine-mounted controls and high power switches generating significant amount of heat such as in next-generation vehicles can utilize the switching efficiencies and high energy densities afforded by gallium nitride (GaN), and silicon carbide (SiC) only when the entire system can withstand and support such extreme ambient and semiconductor device temperatures. However, without the existence of packaging materials which can withstand the extreme temperatures (sustained temperatures of >200°C) and operating conditions in a reliable manner without sacrificing thermal conductivity, WBG technologies can never attain their full potential. None of the polymer- based TIMs (greases, gels, and phase change materials, and bonded interface materials including solder and adhesives) offer the necessary thermal reliability. Even sintered-silver-based bonded interface materials, which in principle can withstand temperatures much greater than 200-225°C, do not offer proven thermal performance and reliability at such temperatures. New TIM advancements are therefore necessary to increase the steady-state temperature capability to temperatures of >250°C, without sacrificing workability, thermal performance or cycle life. New TIMs are developed by ADA with targeted thermal resistance values less than 0.003-0.004°C.in^2/W (2-3 mm^2.K/W) at a bondline thickness (BLT) of 0.002-0.003 in. (50 to 75 micron), while withstanding a continuous operation of at least 250°C and very good reliability with respect to aging, temperature cycling and thermo-mechanical stresses.|
|Sayangdev Naha, Vice President