Abstract Preview

Here is the abstract you requested from the dpc_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

3D TSV Inductors for Secure IoT
Keywords: TSV, Inductor, IoT
This paper describes the design of through-silicon via (TSV)-based inductors for secure tunable Internet of Things (IoT) devices. For a cybersecurity infrastructure, we designed a 3D inductors with security hardware using physically unclonable function (PUF) circuit. The secure 3D inductor could be tuned to desirable frequency by using MEMS switches. Different fabrication technique of 3D TSV inductors are provided to maintain high Q and inductance in high frequency.
Bruce Kim, Professor
City University of New York
Alpine, NJ
United States

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic