Abstract Preview

Here is the abstract you requested from the dpc_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Packaging and Integration Strategy for mmWave Products
Keywords: mmWave, 5g, system integration
The fifth Generation (5G) mobile communication era is expected to address the insatiable need for data communication by introducing mmWave technolgy and protocols to effectievely. to be The unprecedented latencies offered by 5G Networks will enable users to indulge in gigabit speed immersive services regardless of geographical and time dependent factors. The key to enabling this architecture is packaging and system integration, especially involving an effective antenna structure and RFIC communication in cost-effective, small form-factor packages. As full speed development, demonstration and qualification of mmWave systems have accelerated in 2017, different design and packaging archtiectures are emerging. This paper will provide a comprehensive landscape of development options including LTCC, eWLB/FOWLP as well as laminate based packaging. The specific requirements of materials and process needs (low dielectric material, copper roughness requirements etc) will be discussed. Multiple different package structures will be presented as case studies to demonstrate comparative performance of eWLB vs laminate packages. Product application spaces ranging from mobile/handheld to network infrastructures and automotive/satellite radars will be presented.
Urmi Ray,
Fremont, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic