Here is the abstract you requested from the dpc_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Addressing the Challenges of Multi-layer Polymer Processing for Fan-Out Wafer Level Packaging|
|Keywords: multilayer polymer process, fan-out , FOWLP|
|Polymer coatings such as polyimide, BCB, and PBO’s have been a part of the semiconductor industry for decades. As a device topcoat to buffer from the harsh encapsulant process, the polyimide cure process has been easy and straightforward. Spin it on, open up the bond pads and bake until done. However, with the advent of bond pad re-routing and various Fan Out and Fan In processing, multiple layers of polymer are used both as dielectric layers as well as more traditional buffering layers. The layers can interact during processing creating unanticipated problems unless precautions are taken in the curing of individual layers. This paper will address these challenges and give some guidelines for setting up a multilayer polymer process.|
|Ken Sautter, Applications Manager
Yield Engineering Systems, Inc.