Here is the abstract you requested from the dpc_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Advantages of through glass via (TGV) for RF Front End|
|Keywords: tgv, rf front end, 3d solenoid inductor|
|Mobile and hand-held devices are adding more functionality and more frequency bands making the RF front end (RFFE) complicated. RF filters play a vital role in RFFE where inductors and capacitors are the key building blocks. High-Q inductors enable to achieve high performance of these filters. In this paper we are presenting a 3-D solenoid inductor built with Though Glass Via (TGV) technology. In addition to providing high Qs for inductors, TGV technology offers flexibility in managing device size and thermal performance.|