Micross

Abstract Preview

Here is the abstract you requested from the dpc_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Thermo-mechanical modeling for 3D heterogeneous packaging
Keywords: thermo-mechanical modeling, 3d, heterogeneous packaging
We analyze thermo-mechanical behavior of a 3-dimensional (3-D) heterogeneous package consisting of a molded interconnect die to integrate the GPU with the memory. We develop a 3-D finite element model, incorporating effects of geometric and temperature dependent material non-linearities, to predict the evolution of warpage and residual stresses during foundry and assembly processes. Effects of (i) process variables including temperatures of underfill (UF), epoxy mold compound (EMC) and polyimide cure and solder reflow, (ii) material parameters of temporary carries, EMC and UF and (iii) design variables including the mold to silicon ratio, pre- and post-grind thicknesses and the UF fillet depth on the warpage have been delineated. Based on the results, optimum values of these variables have been obtained that minimize the warpage.
Priyal Shah,
Advanced Micro Devices, Inc.
,
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems