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|Thermo-mechanical modeling for 3D heterogeneous packaging|
|Keywords: thermo-mechanical modeling, 3d, heterogeneous packaging|
|We analyze thermo-mechanical behavior of a 3-dimensional (3-D) heterogeneous package consisting of a molded interconnect die to integrate the GPU with the memory. We develop a 3-D finite element model, incorporating effects of geometric and temperature dependent material non-linearities, to predict the evolution of warpage and residual stresses during foundry and assembly processes. Effects of (i) process variables including temperatures of underfill (UF), epoxy mold compound (EMC) and polyimide cure and solder reflow, (ii) material parameters of temporary carries, EMC and UF and (iii) design variables including the mold to silicon ratio, pre- and post-grind thicknesses and the UF fillet depth on the warpage have been delineated. Based on the results, optimum values of these variables have been obtained that minimize the warpage.|
Advanced Micro Devices, Inc.