Here is the abstract you requested from the dpc_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|3D and Advanced Packaging Trends in Foundry Space|
|Keywords: 3D, Advanced Packaging, Advanced Si Nodes|
|Applications in Networking, Machine Learning, and other High-end Computing create the need for architectures that allow for processing of massive amount of data located in nearby memory through communication with the CPU/ GPU with low latency, parallel processing, and high data rate. To enable these solutions, advanced Si nodes with High-Speed-SERDES (HSS), enhanced HBM-PHY, and highly integrated package technologies are required. The packaging solutions that can provide the level of integration required include MCM, 2.5D, and 3D. The general trends and challenges with the integration schemes seen across all these package types are the increased body size to accommodate for larger logic die and the integration of higher number of components, advanced low loss dielectrics, multilayer-cored substrates, beyond full reticle Si interposer, higher density routing schemes, and thermal solutions. The challenge for Foundry is to enable these solutions through the co-design with the customer and within a business model that provides the package design, technology integration, and OSAT manufacturing process, in a flexible model meeting the customers’ needs.|
|Hamid Eslampour, CMOS BU Product Management