Honeywell

Abstract Preview

Here is the abstract you requested from the dpc_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Integration of a Chemically-Amplified Photoresist and an Advanced Packaging Stepper for Advanced Packaging Technologies
Keywords: Photoresist, Advanced Packaging Stepper, Photomasking material
Advanced packaging technologies require materials that will allow for better resolution of patterns associated with the ever more challenging device architecture, along with materials that will allow for higher throughput. Device throughput can be increased with imaging materials that have higher sensitivity. Chemically-amplified photoresists offer the advantages of excellent sensitivity and resolution with good process margins, coupled with excellent stripping performance and plating bath compatibility for the film thicknesses that are required in packaging applications. However, it is the integration of the photomasking material and the availability of today’s advanced back-end exposure tools that allow for improved lithographic imaging. It is this combination that is necessary for meeting the demands of today’s higher resolution and tighter pitch requirements for back-end plating applications, which is essential in producing metallized structures for copper pillar and solder applications. Because the profile of the resist image is directly transferred during the electroplating process, it is critical to have a well-formed image that is resistant to the plating chemistry. Plating bath contamination and resist strippability are other key factors in producing void-free, defect-free structures. Dow’s newly-introduced chemically-amplified material is capable of film thicknesses from 30 m to 80 m by a single coating process with good uniformity. Imaging and process latitude at multiple wavelengths using a 0.10NA WLP/PLP stepper and a 0.15NA PLP stepper are demonstrated at 50 m thicknesses with emphasis on sidewall profiles and sensitivity. The power of integrating the enhancement image contrast via chemical amplification and improved optical design has enabled the development of higher resolution finer pitch back end processing for advanced packaging technologies. Resolution and plating capability related to through-pitch performance will be discussed as a function of the resist/exposure tool combination.
Keith Best, Director Applications Engineering
Rudolph Technologies
Wilmington, MA
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems