Here is the abstract you requested from the dpc_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Market and technology trends of advanced packaging for SiP application|
|Keywords: market trends, advanced packaging, SiP|
|System in Package or SiP is defined as the any combination of one or more ICs of different functionalities, which may include passive components and/or MEMS/sensors/optical components assembled into a single package that performs as a system or sub-system. The power of SiP is the ability to bring together many IC and package assembly and test technologies to create highly integrated products with optimized cost, size and performance. SiP is one of the fastest growing packaging technology driven by lower cost, smaller form factor, higher levels of integration and better performance. The IC industry is looking beyond scaling (“More Moore”) to heterogeneous integration (“More than Moore”) to achieve high performance and more functionality at reasonable cost. The trend is from SoC to SiP. Traditionally SiP growth mainly led by the mobile and wireless application. However it has started to penetrate into the IoT, wearables, automotive, medical and high end computing market segment. Various packaging technologies from the wire bond and flip-chip to more complex FOWLP and 2.5D/3D TSV support the SiP configuration. The talk will discuss about the market and technology trends of SiP. The focus will be on the potential and application of the advanced packaging technology such as fan-out WLP and 2.5/3D as the enabler of SiP.|