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|Sixty Earth-days Test of Prototype Pt/HTCC Alumina Package in Simulated Venus Environment|
|Keywords: high temperature, packaging, HTCC|
|Abstract The prolonged operation of semiconductor integrated circuits (ICs), including packaging and integration technologies, for long- term exploration of the surface of Venus is challenging due to the high temperature (460°C) high pressure (9.4MPa) and chemically corrosive atmosphere of the planet . After experimental investigation of high temperature dielectric properties of a selected high temperature co-fired ceramic (HTCC) alumina in a temperature range from room temperature to 550°C , a packaging material system composed of HTCC alumina with co-fired platinum (Pt) metallization had been proposed for high temperature harsh environment packaging applications. A prototype package with 32-I/O (inputs/outputs) and circuit board based on this co- fired material system have been developed  and successfully tested with multiple analog and digital silicon carbide (SiC) high temperatures semiconductor ICs (developed at NASA Glenn Research Center) in 500°C Earth air ambient for thousands of hours , as well as for short-term operation at temperatures above 800°C . In order to further identify and qualify a harsh environment durable electronic packaging material system for long term Venus exploration, a HTCC alumina packaging substrate with co-fired Pt metallization was previously tested supporting test of a SiC IC in a simulated Venus atmosphere environment for three Earth weeks . This paper discusses thermal and electrical test results of a prototype HTCC package with Au/Pt metallization in situ simulated Venus environment for sixty Earth days, as well as results in high temperature Earth ambient. The test in simulated Venus environment was implemented in NASA Glenn Extreme Environment Rig (GEER). Initial analytical results of materials of the packaging system after exposure to Venus environment will be discussed.|
|Liangyu Chen, Senior Scientist
Ohio Aerospace Institute/NASA GRC