Here is the abstract you requested from the HITEC_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Lifetime and Failure Modes of High Temperature SOI Products|
|Keywords: Reliability, Silicon-on-Insulator, Failure Modes|
|RelChip has performed life test studies on its RAM and has shown that Silicon On Insulator (SOI) processing with Aluminum-Tungstun metal traces do not fail due to electromigration and can operate for over 4000 hours at 350°C. Three parts were randomly selected and functionally tested at the extreme temperature using HAST. The parts were pulled periodically for in-depth testing and examination. Test results indicate failures are due to device failures, and not electromigration.|
|Derek Maxwell, QA Manager