Honeywell

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Effect of Third Elements on Mechanical Properties of Transient Liquid Phase Sintered (TLPS) Alloys
Keywords: Power Electronics, Transient Liquid Phase Sintering, Nano-indentation
New die attach materials are needed for power electronic devices in environments with high temperature conditions. Transient Liquid Phase Sintered (TLPS) paste based solder alloys have been demonstrated to effectively manage the thermal and mechanical load requirements of power modules. The complex microstructural features of these alloys provide interconnects with the necessary strength required to sustain extreme conditions. However, TLPS systems may be brittle, and that presents an opportunity to investigate more ductile materials that can be incorporated into the system in order to improve the TLPS behavior. To properly understand the influence of micro-constituents on the mechanical behavior of TLPS, lap shear testing was performed on Cu-Sn systems with additions of more compliant third element particles. Nano-indentation measurements were performed on each TLPS system to identify the intermetallic phases that develop at initial bonding condition. Mechanical properties of these are also identified by use of nano-indentation. Simulations of lap shear specimens were made using an approach which enables the contribution of particle size and voids in the sintered joints to be evaluated. Nano-indentation results were used as input for simulation in order to replicate the experimental procedure in the laboratory with the TLPS samples. Measured properties of intermetallic phases along with bulk properties are used as input for finite element analysis (FEA) in determining shear strength of the joint and this is validated with experimental results.
Erick Gutierrez,
University of Maryland
Silver Spring, Maryland
USA


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