Here is the abstract you requested from the imaps_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|The Effect of Nickel Oxide Formed in the Interface of ENEPIG Structure for Flip Chip Technology|
|Keywords: Nickel oxide, ENEPIG, Interposer|
|In microelectronic packaging due to the solder balls used to join substrate and chips are downsizing. This may have an adverse influence for the reliability in electronic products. Moreover, the European|
|Chuan Lung Chuang, Sr. Engineer
Taoyuan City, Taiwan, R.O.C.