Honeywell

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The Effect of Nickel Oxide Formed in the Interface of ENEPIG Structure for Flip Chip Technology
Keywords: Nickel oxide, ENEPIG, Interposer
In microelectronic packaging due to the solder balls used to join substrate and chips are downsizing. This may have an adverse influence for the reliability in electronic products. Moreover, the European
Chuan Lung Chuang, Sr. Engineer
ASE Global
Taoyuan City, Taiwan, R.O.C.
Taiwan, R.O.C.


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