Abstract Preview

Here is the abstract you requested from the imaps_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

A 3D System-in-Package (SiP) for RF Application
Keywords: 3D RF SiP, 3D stacked structure, Antenna
A novel 3D packaging technology of substrate-based platform – double side assembly (DSM) is introduced in this paper. This technology is capable of integrating RF front-end module (FEM) with the advantage of packaging cost effectiveness, excellent warpage control, and enhanced reliability. System in Package (SiP) allows system designers to differentiate their products from others by integrating more functions to meet markets’ requirement. It can also reduce the complexity of HW design while meeting their device / system requirements. A lot of innovations in SiP technologies – Flip-Chip, Fan-Out and beyond are fulfilled in achieving higher bandwidth, smaller form factor, with increased functionality and mixed wafer nodes. In addition, new frequency bands of connected devices and denser component population have led to a demand for aggressive size reduction of RF FEM packaging solutions with good reliabilities and thermal management. The highly integrated LTE modem and RF FEM structure are crucial for modern premium tier smart phones’ success, and are always a big challenge in the packaging industry due to its highly requirement of performance and manufacturing stability.
Shihwen (Wayne) Lu, Sr. Dept. Manager
ASE Group (Chung-Li)
Taoyuan, Taiwan

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic