Here is the abstract you requested from the imaps_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Unlocking the full Potential of Lithography for Advanced Packaging|
|Keywords: Lithography Stepper, High resolution Fan-Out, Laser Technology|
|Unlocking the full Potential of Lithography for Advanced Packaging. Abstract for a contribution to Conferences & Workshops for IMAPS 2018, 51st Symposium on Microelectronics. Pasadena Oct 9 – 11, 2018. Authors: - Jelle van der Voort (+). - Michiel van der Stam (+). (+) Kulicke & Soffa Liteq B.V., Esp 314, 5633 AE Eindhoven, The Netherlands. Advanced Packaging technologies and applications are developing rapidly in order to support the ever increasing demand of integrating functionality in the form of small and thin devices with low power consumption, high bandwidth, low latency and against low cost. Lithography is key enabling technology for developing and manufacturing these devices. The Advanced packaging technology roadmap is driving towards redistribution patterns with smallest feature sizes of a few micron today and sub-2-micron in future. These feature sizes must be realized in production processes with multiple layers stacked on top of each other which need to be accurately aligned. In order to meet economic boundary conditions routine operation on 300 mm (possibly strongly warped) wafers is required. Together with key partners we have developed a novel Lithography system which is focused specifically to meet the challenging requirements for both current and future applications in the area of Advanced Packaging. The high quality optics is capable of imaging a large reticle field with low aberrations onto the wafer. The magnification of the optics is tunable for optimal overlay performance. The reticle is illuminated by a high power UV laser. This novel setup creates many advantages for Imaging, Cost of Ownership and Throughput. The illumination and projection optics is combined with modern mechatronics to handle warped wafers, with a strong focus on contamination control and Wafer Edge Processing functions. The combination of these capabilities enable the system to be used as part of state-of-the-art plating process flows. The modularity of the system architecture makes it possible to extend functionality and performance in future. During this presentation we will introduce the novel LITEQ 500 projection stepper and present results achieved in the area of Imaging, Throughput and Cost of Ownership for different Use Cases.|
|Jelle van der Voort, Marketing & Sales Director
Kulicke & Soffa Liteq B.V.