Here is the abstract you requested from the imaps_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Modern electronics production and its requirement towards automatic inspection and automation|
|Keywords: Improve Quality, Reduce Scrap, Automatic Optical Inspection|
|Modern electronics production and its requirement towards automatic inspection and automation. Visiting a major chip manufactures fab is an exceptional experience. Starting from the design of the clean rooms to the automation level -- there is a huge amount of specially dedicated equipment. These types of fabs underwent major investment cycles to ensure stable, high quality and high yield production. Visiting many production lines for Ceramic Electronics or PCBs, you often see a totally different picture. Clean room conditions differ greatly from their given name and, quite often, should not be called cleaned rooms. The result is often contamination with particles, even finger prints, and consequently low yield production facilities. The production equipment has often been used for decades (like screen printers, ovens) and is not maintained at required intervals. These factories, on the other hand, will be tasked with making more compact high density electronic challenges in the future. Automation and Automatic Optical Inspection will play a key role in increased production quality, where reducing scrap rate and cost reduction are the key elements. Manual plants will be transitioned to an automated production environment and need to carefully consider what approach is best to minimize scrap rate and optimize quality. We want to suggest an approach to certain aspects of this transition, offer solutions for traceability and tool selection. Our unique role as a provider for AOI and automation solutions has enabled us to support our customers in every aspect of such a transition. Considering traceability, optimized tooling and the adjusting to each manufacturers individual requirements, we propose a flexible and scalable solution for small and large factories. Wafers Technologies (Ceramics, Hybrids, LCTT/HTCC, advanced PCBs, Batteries, Power electronics, …) Cost Integration level (Islands, Full or partial automation) Selection Risks, challenges, Transition period and concepts Benefits investments Designs and practical examples Traceability and Integration|
|Sebastian Stenger, , Sales Manager AOI