Honeywell

Abstract Preview

Here is the abstract you requested from the imaps_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Synthesis, Characterization, and Processing of Novel Metallic Core-Shell Materials for Thick-Film Applications
Keywords: core-shell, LTCC, microstructure
A series of novel metallic core-shell powder materials are prepared, and their thermomechanical properties for thick-film applications will be explored. Submicron control of coating thickness, structural ordering, and composition is achieved via chemical precipitation reactions carried out in the presence of base metal and alloy powders which serve as coating substrates. Interdiffusion of the core and shell materials caused by subsequent thermal processing reorders the starting core-shell arrangement to yield the final application-level performance. The robust chemical precipitation approaches employed enable a semi- combinatorial approach for coating a collection of base metal and alloy powder materials with both precious metal and transition-metal-based shells. When coupled with the set of possible shell materials to be presented herein, the array of commercially-available substrate powder materials allows targeted core- shell engineering toward a diverse set of processing windows, matrix conditions, and end use applications. In addition to initial powder characterization, the performance and reliability of the materials in thick films on LTCC tapes for the core-shell systems chosen will be investigated and discussed. Microstructural analysis of the surface printed, buried, and via architectures is examined, as well as bondability strengths.
Kyle Bandaccari, Development Scientist
SVMT LLC
Sunnyvale, CA
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic