Honeywell

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Flip chip reliability and design rules for SIP module.
Keywords: Flip-chip, copper pillar, reliability
In the aeronautical field, the electronic integration roadmaps show that the weight and the volume dedicated to on-board electronics must be reduced by a factor of 4 to 10 compared to the existing ones for the most recurrent functions in the next years. This work is an opening of new technological solutions to increase our ability to integrate more electronic components in the same space while improving the overall reliability of the system. The first part of this work is dedicated to the study of
Morard Adrien, Phd
Safrantech
Magnyles-hameaux, Yvelines
France


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