Here is the abstract you requested from the imaps_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Flip chip reliability and design rules for SIP module.|
|Keywords: Flip-chip, copper pillar, reliability|
|In the aeronautical field, the electronic integration roadmaps show that the weight and the volume dedicated to on-board electronics must be reduced by a factor of 4 to 10 compared to the existing ones for the most recurrent functions in the next years. This work is an opening of new technological solutions to increase our ability to integrate more electronic components in the same space while improving the overall reliability of the system. The first part of this work is dedicated to the study of|
|Morard Adrien, Phd