Device Packaging 2019

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Fabrication of an advanced epoxy based molding compound with high thermal conductivity and exceptional mechanical properties
Keywords: hexagonal boron nitride, surface modification, thermal conductivity
A novel molding compound was fabricated through functionalization of oxidized aluminum and hexagonal boron nitride particles followed by chemical grafting to an epoxy based resin. The fabricated material demonstrated high thermal conductivity and exceptional mechanical properties. The surface of aluminum particles were oxidized chemically followed by functionalization with a polyhydroxylated stearic acid. The surface of hBN particles were partially hydroxylated followed by grafting with an aromatic triisocyanate followed by grafting with an appropriate polyol that could easily graft to any epoxy-based resin. As a result, the fabricated composite contained mixed fillers of hBN and oxidized aluminum that were chemically bonded to epoxy skeleton. The chemical bond formation between ceramic fillers and organic matrix was responsible for high thermal conductivity as well as outstanding mechanical properties. As well, the loading capacity of epoxy matrix to surface modified fillers was remarkably higher than non-modified fillers. The novel molding compound with outstanding mechanical properties and thermal conductivity can open extensive applications for electronic packaging.
Nazila Dadvand, Packaging Engineer
Texas Instrument
Dallas, Texas
USA


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