Here is the abstract you requested from the imaps_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Reversed pulse plating of nanostructured silver-cobalt alloys for connector applications|
|Keywords: silver-cobalt, reversed pulsed electrodeposion, connectors|
|The described research work focuses on using of anti-galling silver-cobalt alloy as a novel metallic contact ﬁnish for connector applications. The purpose of this work was to develop a cost-effective and cyanide-free “self-lubricated” silver alloy deposited using reversed pulse electrodeposition process for silver-based contact ﬁnishes in electrical contacts applications. This work describes the new formulated silver-cobalt alloy deposited through reversed pulse-electroplating process that provides exceptionally low friction coefﬁcient (similar to hard gold) and outstanding wear resistance compared to standard silver and any commercially available electroplated silver alloys such as silver-tin, silver palladium, silver antimony, silver-bismuth, silver-tellurium, and silver-tungsten|
|Nazila Dadvand, Packaging Engineer