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Reversed pulse plating of nanostructured silver-cobalt alloys for connector applications
Keywords: silver-cobalt, reversed pulsed electrodeposion, connectors
The described research work focuses on using of anti-galling silver-cobalt alloy as a novel metallic contact finish for connector applications. The purpose of this work was to develop a cost-effective and cyanide-free “self-lubricated” silver alloy deposited using reversed pulse electrodeposition process for silver-based contact finishes in electrical contacts applications. This work describes the new formulated silver-cobalt alloy deposited through reversed pulse-electroplating process that provides exceptionally low friction coefficient (similar to hard gold) and outstanding wear resistance compared to standard silver and any commercially available electroplated silver alloys such as silver-tin, silver palladium, silver antimony, silver-bismuth, silver-tellurium, and silver-tungsten
Nazila Dadvand, Packaging Engineer
Texas Instrument
Dallas, Texas
USA


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