Abstract Preview

Here is the abstract you requested from the imaps_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

When failure is not an option � Packaging materials and technologies for the reliable protection of medical electronics
Keywords: Reliability, Hermeticity, Inorganic materials (e.g. glass, ceramics)
When failure is not an option � Packaging materials and technologies for the reliable protection of medical electronics In the medical industry, it is a necessity for the packaging materials of electronics to enable high-level electrical performance and smooth optical signal transmission. At the same time, a major challenge comes in the form of protection needs: medical packaging must deliver absolute reliability by guarding sensitive chips and microelectronic components against potentially damaging working environment hazards such as high humidity, extreme temperatures, corrosive chemicals, and bodily fluids. Hermeticity is an important factor in the performance of medical packaging. Non-hermetic packaging, sometimes known as �quasi-hermetic,� uses organic materials such as silicon or plastic over-moldings that are not designed to withstand extreme conditions and break down over time. These types of packages can potentially deliver incomplete protection by allowing the inflow of water and other gases through the polymer structure. Non-hermetic packages typically reach critical permeation rates after a very short period of time. For microelectronic components, even the smallest, hardly detectable traces of hydrogen and water vapor inside a package can compromise the performance and reliability of the encapsulated chips and circuits. The reliability challenge can only be conquered in the most sound and complete way possible by using hermetic packaging technologies with inorganic materials, such as glass, ceramics and metal. Unique manufacturing processes of these hermetic components create vacuum- tight seals that prevent moisture and harmful gases from penetrating into the package. Hermetically sealed packages deliver uncompromised reliability, offering long-term protection of sensitive electronics in medical devices � even after thousands of procedures and steam sterilization cycles. This technical presentation will introduce the different reliability levels of packaging materials and provide an in-depth comparison as well as the latest insights into materials and technologies available for high- reliability packaging of medical electronics. This will include a comparison of the respective advantages, disadvantages and typical application areas of various hermetic packaging technologies.
Jochen Herzberg, Senior Program Manager Medical
Landshut, Deutschland

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic