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fcLGA Package Assembly Qualification for mobile applications
Keywords: fcLGA, assembly, Reliability
Flip Chip Land Grid Array (FcLGA)packages are widely used in Mobile product applications due to their thin form factor and performance. Assembly process qualification requires careful selection of materials and optimization of reflow processes to make consistent and reliable product. The fcLGA uses a substrate on which the die is reflowed instead of the typical copper leadframe used in QFN packages. This requires assessment of CTE mismatch and controlled reflow processes to prevent bump cracking . The paper reviews the selection of substrate, optimization of assembly process and reliability testing conducted for package qualification
Mumtaz Bora, Sr. Staff Packaging Engineer
San Diego, CA

  • Amkor
  • ASE
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  • Corning
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  • Honeywell
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  • Kester
  • Kyocera America
  • Master Bond
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  • MRSI
  • Palomar
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  • Qualcomm
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  • Raytheon
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  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic