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Design of LTCC Devices for Wireless Communication
Keywords: LTCC, Wireless communcation, RF front-end
Wireless communication systems demand materials and processes that can meet the requirements of shrinking circuit dimension, high level of passive integration, exceptional high frequency performance, excellent reliability, quick prototype turnaround times and low cost. Low- temperature cofired ceramics (LTCC) with high electrical conductivity metallization such as Cu and Ag has been identified to be an enabling solution for these challenges. In this presentation, design of RF circuits, materials and processes for fabrication of miniaturized LTCC devices and front-end modules will be discussed.
Jau-Ho Jean,
National Tsing Hua University
Hsinchu, Taiwan

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