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A numerical study on mitigation of flying dies in compression molding of microelectronic packages
Keywords: Compression Molding, Flying Die, Force
In microelectronics packaging process steps comprising liquid encapsulants are often considered as critical because encapsulant flow is sometimes hard to predict especially when material properties are changing over time and depend on process conditions in a complex way: This is present in reactive systems of highly filled epoxy resins used for compression molding. Shear-thinning properties are superimposed by time and temperature-dependent curing behavior, forming a highly nonlinear, complex interplay. Simulations are a valuable tool to gain insight into the flow kinematics and to find sets of optimized parameters in order to minimize forces exerted on chips during the filling stage without consuming actual materials. An analytical approach is applied to approximate the melt front velocity during the compression molding process. Simulations of high-resolution sub-models of areas of special interest are established, which allow detailed insight and capture the nonlinear kinematics at a reduced computational effort. A framework to extract forces on individual chips in Fan-Out Wafer/Panel Level Packaging (FOW/PLP) is presented with an emphasis on a separate analysis of force contributions from different faces of the chip. Hence, the influence of pressure and shear-forces can be evaluated and discussed separately. With the approaches applied the following recommendations and results are obtained - Deeper understanding of flow behavior during compression molding - Recommendations for process parameter windows
Marc Dreissigacker,
TU Berlin
Berlin, Berlin
Germany


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