Here is the abstract you requested from the imaps_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Glass Encapsulation for Wireless Highly Miniaturized Implantable Devices|
|Keywords: Implantable devices, glass encapsulation, wireless|
|GlencaTec's cylindrical and planar glass encapsulation service makes miniaturized transparent packaging real. Single tubular glass component protects optical sensors, markers or identifier for in-body and in-process application. Bonding of flat tailored housing or of wafer by laser micro welding allows an additive-free hermetic connection of glass-glass and glass-silicon. Thanks to the low temperature impact on embedded micro-systems, sensitive electronics are protected from the harsh environment. Transparency to RF means telemetry and inductive power coupling can be realized with lower power consumption.|