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Glass Encapsulation for Wireless Highly Miniaturized Implantable Devices
Keywords: Implantable devices, glass encapsulation, wireless
GlencaTec's cylindrical and planar glass encapsulation service makes miniaturized transparent packaging real. Single tubular glass component protects optical sensors, markers or identifier for in-body and in-process application. Bonding of flat tailored housing or of wafer by laser micro welding allows an additive-free hermetic connection of glass-glass and glass-silicon. Thanks to the low temperature impact on embedded micro-systems, sensitive electronics are protected from the harsh environment. Transparency to RF means telemetry and inductive power coupling can be realized with lower power consumption.
Jim Ohneck,
GlencaTec AG

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