KemLab

Abstract Preview

Here is the abstract you requested from the imaps_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

A Network for Silicon Interconnect Fabric
Keywords: Silicon Interconnect Fabric, Si-IF, heterogeneous integration
Silicon interconnect fabric (Si-IF) is a platform for heterogeneous systems integration. This platform supports attachment of unpackaged dies at a fine pitch (≤ 10 μm) and small spacing (≤ 100 μm). To enable effective communication, power regulation, test, and other system-level aspects, a network on interconnect fabric is proposed. The network is based on discrete utility dies attached to the Si-IF that include circuitry to support system-level requirements.
Boris Vaisband, Postdoctoral scholar
UCLA
Los Angeles, CA
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic