Honeywell

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Dynamically Controlled Flow Loop to Benchmark Rapid Transient Cooling Utilizing Flash Boiling for High Heat Flux Electronic Systems
Keywords: flow loop, high heat flux, rapid transient cooling
Transient thermal systems with high-heat-flux components present significant challenges. Flash cooling is a promising phenomenon to help mitigate the thermal challenges of future electronic components. We present a flow loop in this work to provide a flexible and reliable setup to investigate and benchmark flash cooling. It is dynamically controlled through LabVIEW workbench using a micro-controller from National Instruments to facilitate transient response of the system. The quick response of the loop is achieved with the help of flow control components with a response time of few milliseconds. The setup is compatible with certain promising fluids for flash cooling and the connections are built in a manner that allows quick replacement of components including the test device. Being a closed loop system with a water-cooled condenser, it allows continuous operation of the system. The flow loop facilitates deeper understanding of the advantages and limitations of flash cooling for future electronic applications.
Ujash Shah, PhD Student
UCLA
Los Angeles, CA
USA


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