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Integrated Sensor Nodes for Industry 4.0 Applications
Keywords: Sensor nodes, pcb 4.0, miniaturized rf sensor
The PCB 4.0 research project offers the opportunity to take the flexibility, energy and resource efficiency of production processes to a whole new level with intelligent control and networking. Electronics and sensors, which are among the strengths of small and medium-sized enterprises (SMEs) in Germany in particular, play a key role here. For flexible and efficient data acquisition, sensors must be integrated as compactly as possible into workpieces and systems. Miniaturized radio sensor nodes offer this possibility, but are currently still a major technical challenge in production and integration. The objective of the research project PCB 4.0 is the creation of a technology platform for the design and manufacture of embedded miniaturized RF sensor nodes and their integration into production processes. In addition to design methods as well as module and design concepts, the partners will develop strategies for mass production. The performance of the developed technologies shall be demonstrated by means of radio sensor layers, which, integrated in printed circuit boards, detect and process the actual state in the production of industrial electronics in real time. Self-diagnostic methods allow complete condition-based maintenance of the production process. Within the project a high degree of miniaturization of radio sensors for Industry 4.0 applications is achieved with the help of embedding technology. This development enables industry to expand their market position in the field of industrial automation and opens up new fields of application. The construction of a technology platform and the definition of suitable interfaces simplify the implementation of embedded wireless sensors for future applications.
Steve Voges,
Fraunhofer IZM
Berlin, D

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