Here is the abstract you requested from the medical_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Through Glass Via Technology for Medical Applications|
|Keywords: FDA, RoHS, high frequency|
|Glass based materials have superior properties compared to organic and silicon substrates. Their optical transparency, surface roughness, and dielectric properties position them as the logical choice for advanced medical packaging. Certain glass types are FDA approved to be used as implantable devices, allowing extreme miniaturization and high reliability. Samtec has developed a unique, thick film based approach to metalize the through glass vias (TGVs) with diameters spanning 30-200 µm. A wide range of glass types have been successfully studied, including borosilicate, sapphire, quartz, and yttria-stabilized zirconia (YSZ). Recent advances in via formation results in stress free holes with no heat affected zone (HAZ). The holes are subsequently filled with metal based thick film and fired at elevated temperatures for electrical interconnection via sintering. The filled vias allow for further RDL metallization on both sides of the glass wafer. The unique metallization compositions allow the thick film to fully interact with the via wall and heal any defects caused during the hole formation process. This enables hermeticity and high reliability due to the fully densified structure. The thick film composition is fully RoHS compatible; Lead-free, Cadmium-free and Phthalate-free. Our presentation will discuss materials, process, and characterization methods used to realize the TGVs. Applications in Microfluidics, Lab-on-Chip and other biomedical applications will be examined and discussed.|