Here is the abstract you requested from the Thermal_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Performance of Single Phase Liquid Cold Plates for High Power MOSFETs|
|Keywords: Liquid Cooling, CFD, MOSFET|
|High-volume manufacturing of semiconductor devices conventionally utilizes RF power supplies to couple RF energy to a plasma reactor for surface treatment on a Silicon wafer. High-power Silicon MOSFET devices are critical components in the generation of this RF power. Conventionally, high-power RF devices with high dissipation require direct mounting to liquid cold plates. Copper is the material of choice due the water quality available at semiconductor manufacturing facilities for liquid cooling. Several types of cost effective single phase cold plates can be made from gun drilled copper plates, embedded copper tubes, milled or skived copper mini-channels and liquid jet nozzles. The contact resistance resulting from manufacturing between tube and cold plate impacts the heat sink and device temperatures. We describe CFD modeling and validation testing of several common cold plate designs to determine the best performer and single phase upper limits in terms of overall thermal resistance, pressure drop and cost. In addition a simple jet impingement heat sink is tested. The die is modeled in detail for several common MOSFET devices. Validation testing is accomplished using infrared cameras directed onto the surface of the devices and embedded thermocouples in the cold plate. The CFD model allows averaging of surface temperatures for calculations of the resistance contribution of the device, interfaces and heat sink, as well as pressure drop calculations, and performance at extended operating conditions or design variants.|
|Stephan Fatschel, Principal Mechanical Engineer