Honeywell

Abstract Preview

Here is the abstract you requested from the Thermal_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Dielectric vs thermal conductivity index
Keywords: dielectric, thermal conductivity, partial discharges
This paper describes an index that I called for brevity the Brega Index, is a parameter useful to make a classification of materials that request dielectric and thermal conductivity characteristics. I created this index nearly 20 years ago, to solve the challenge to select dielectric interface to design dielectric heatsinks. The dielectric heatsinks are employed in the railways and medical sector, usually to ensure double insulation to the IGBT, and they can work at about 3-5000 V and require low partial discharges level. When selecting an interface it’s not obvious to choose the right material that can insure the needed electric insulation, minimize the thermal resistance, thickness and a low level of partial discharges. The index presented in the paper allow to fill a table with a classification from the most to the less performant, the designer can go through the list starting from the top, where we find material like diamond, down to commercially suitable choices, till he find the right balance between costs and dielectric-thermal conductivity performance. This index allowed me, when I was in Aavid Thermalloy, to invent the Aablue Technology, still employed today to realize dielectric heatsink for railways and medical equipment. The strength of this approach have been confirmed by the fact that others companies has adopted the same technology.
Enrico Brega, Thermal management specialist
BLV Licht GmbH
Steinhöring, BY
Germany


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic