Device Packaging 2019

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Innovation, the Hype Cycle, and Liquid Metal Cooling; Part 1: The Hype Cycle in Electronics Cooling Innovations
Keywords: Hype Cycle, Electronics Cooling, Innovation
The ‘hype cycle’ is a concept used to describe how innovative technologies mature and to help assess where a given technology is on its technology transition path. This presentation will describe the hype cycle and discuss analogies between it and physical mechanisms familiar to engineers. Then, a number of electronics cooling technologies that have receive significant attention over the previous decade will be presented and their status relative to the hype cycle will be discussed.
Ross Wilcoxon, Principal Mechanical Engineer
Rockwell Collins, Inc.
Cedar Rapids, Iowa
United States


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