Here is the abstract you requested from the Thermal_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Innovation, the Hype Cycle, and Liquid Metal Cooling; Part 1: The Hype Cycle in Electronics Cooling Innovations|
|Keywords: Hype Cycle, Electronics Cooling, Innovation|
|The ‘hype cycle’ is a concept used to describe how innovative technologies mature and to help assess where a given technology is on its technology transition path. This presentation will describe the hype cycle and discuss analogies between it and physical mechanisms familiar to engineers. Then, a number of electronics cooling technologies that have receive significant attention over the previous decade will be presented and their status relative to the hype cycle will be discussed.|
|Ross Wilcoxon, Principal Mechanical Engineer
Rockwell Collins, Inc.
Cedar Rapids, Iowa