Device Packaging 2019

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Innovation, the Hype Cycle, and Liquid Metal Cooling; Part 2: The Hype Cycle of Liquid Metal Cooling
Keywords: liquid metal cooling, hype cycle, innovation
Rockwell Collins has investigate the feasibility of using liquid metal cooling for electronics. This presentation will describe the technology, discuss why it holds some promise for certain applications, and give an overview research done to investigate its use. The stages of development of this work are discussed in the context of the hype cycle to help illuminate the types of challenges that can be encountered when developing new technologies.
Ross Wilcoxon, Principal Mechanical Engineer
Rockwell Collins, Inc.
Cedar Rapids, Iowa
United States


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