Device Packaging 2019

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Here is the abstract you requested from the Thermal_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Addressing Challenging Mechanical Reliability Requirements for Thermal Interface Materials Developed for Semiconductor Test/Burn-in Applications
Keywords: semiconductor test, TIM, reliability
Several presentations given at the IMAPS ATW Thermal and at ASME InterPack in recent years have outlined the need for improved durability for thermal interface materials developed for semiconductor test and burn-in applications. These very challenging mechanical requirements are in addition to thermal performance requirements. Development of a mechanical reliability test program to evaluate material performance will be described. Test results for Rth in mechanical cycling of three newly-developed material types will be described, as well as how test program targets were developed. Thickness change (as a control) and mechanical contact cycling for several test program phases will be presented. TIMs evaluated for semiconductor test must meet demanding mechanical and reliability requirements that are not commonly found in other applications; the TIM provides a critical element in thermal control and heat dissipation during testing procedures and, for through-put and cost considerations. The use of gimbaled test heads, assumed non-flat surface contact conditions, repeated contact cycling of the TIM and test head, and elevated temperatures will be described, with test results for two phases of this test program. All testing for this program is conducted by an independent test laboratory using an industry-standard automated ASTM D 5470-17 test platform.
David L. Saums, Principal
DS&A LLC
Amesbury, MA
USA


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