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Case Study: Anomalous Behavior of Mobile Heat Pipes in Low Power and Low Ambient Conditions
Keywords: Heat pipe, Low power, Testing
Two-phase heat transfer devices have enormous benefits in the cooling of mobile and consumer electronics. However, there are limits to the usefulness of this technology. This presentation will explore those limits and the unique phenomenon that can be attributed to miniaturization and low input powers. There are ramifications that extend to product design, manufacturability, and predictability of performance. Understanding these issues allows us to make more informed thermal design decisions, and this talk will cover a case study that highlights these concerns.
Erin Hurbi, Senior Mechanical Engineer
Mountain View, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic