Abstract Preview

Here is the abstract you requested from the wirebonding_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Advanced Wedge Bonding Technologies
Keywords: wedge bonding, ribbon bonding, Pattern Recognition
The explosive growth of global data traffic has resulted in a significant high demand for data bandwidth. As a result, optoelectronic and RF devices keep advancing towards much smaller module size and much higher module frequency. Wedge/ribbon bonding offers deep access, fine pitch and better high frequency performance compared with ball bonding; therefore, wedge/ribbon bonding suits well to support optoelectronic and RF packaging requirements. Driven by both advanced RF and optoelectronic system requirements as well as associated testing equipment, wedge/ribbon bonding not only refines its limit to bond fine wires/ribbons and be able to create specific geometric loop profile, but also makes great improvement on the pattern recognition algorithms to achieve better vision performance. This paper reports some of the latest advances in wedge/ribbon bonding processes at Palomar Technologies to better serve optoelectronic and RF packaging. (1) Technology to bond 0.7mil Au wires on Duroid material will be demonstrated in this report. The robustness test on the wires shows exceptional pull strength (average 7grams) with mid-span break failure mode, which indicates highly reliable Au wedge bonds. (2) A novel loop mode algorithm was recently developed to simplify loop creation process for customers. By inputting 3 main parameters, users can control the loop geometry across various loop spans while keeping peak height and/or location consistent. In a recent application, we have successfully created same loop shapes using only one set of loop parameters across a loop span range from 38mils to 105mils. The resulting loop height variation is less than one wire diameter. (3) Vision Pilot®, since implemented on our model 9000 wedge bonders, has shown superior vision performance over traditional autocorrelation methods. The active graphical feedback mechanism provides great operation ease. Application case studies show that the Vision Pilot® feature is capable of recognizing components with low contrast, such as borderless capacitors or components with large components dimension/surface finish variations.
Wenjuan Qi, Sr Engineer
Palomar Technologies
Carlsbad, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Technic