Here is the abstract you requested from the wirebonding_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Wire Bonder Productivity and Quality Advances for Ultra High Reliability Markets|
|Keywords: productivity, reliability, maintainability|
|Production requirements for automatic wire bonders have been in the process of divergence for several years, based on the unique demands of specific markets. Some markets emphasize high productivity and acceptable reliability above other considerations, while other markets demand much higher levels of production control and traceability, with a willingness to trade off other factors in order to achieve it. These latter markets include, among others, the automotive market. For these markets, quality control stability, including detailed knowledge of machine-to-machine variation among production line machines, together with enhanced productivity for mass production of automotive products is indispensable. To achieve the goals of these especially demanding markets, further technological innovation is needed for semiconductor manufacturing equipment including wire bonders. However wire bonders carry a particularly heavy burden due to their ubiquity and very large numbers in the packaging manufacturing lines used in these ultra high reliability markets. Shinkawa will describe several functions that have been introduced recently, supporting wire bonder Security, Safety and Stability and for improving productivity and reliability. Among the new functions introduced are machine sub-systems called “FAM” and “BIM” which contribute to improved wire bond reliability. “FAM” is real time measurement of the free air ball size, performed automatically on the machine rather than off line as has typically been the case. The FAM technology is enabled using the same machine hardware that automates the fine alignment of the camera to capillary offset which is used to compensate for thermal drift and other impacts to bonding accuracy. Such double usage of hardware limits machine complexity and cost. FAM allows setting of upper and lower control limits on the free air ball size, thus bringing a critical wire bond variable under automated control. The option of offline data logging of FAM values provides documentation of production line quality. “BIM” provides automated post bond inspection of wire bond accuracy at a high resolution level, also with the capability of setting control limits, and data logging for production traceability. Another new function called “UCAC” is aimed at the challenging goal of insuring identical production line performance of multiple wire bonders. This challenge is usually described as “portability” which, when achieved, allows the same process recipes to be used interchangeably on the many bonders which populate high volume assembly lines. While process portability is achieved relatively readily for two of the three major wire bonder process parameters, ultrasonic power has been more difficult to bring under portability control due to the dynamic nature of ultrasonic transducer manufacture and operation. UCAC provides an effective method which simplifies parameter portability control among numerous bonders on a high volume production line. In addition to these reliability improvement features, Shinkawa has improved its productivity through predictive management using automated machine self-diagnostic and recovery functions, and easing machine maintenance by substituting these routines for mechanical jigs. Although automated wire bonding has already achieved several decades of improvement, Shinkawa continues to develop capabilities to expand the reach of this well-established technology.|
|Yoshihito Hagiwara, General Manager, Product Planning