Here is the abstract you requested from the wirebonding_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Method of measuring copper oxide on Cu Wire for wirebonding|
|Keywords: Copper Wire bonding, Measurement method, Oxidation|
|“Wire bonding using Copper has many advantages over Gold wire, but oxidation of Copper is serious issue. Exposure of a clean copper wire to ambient causes gradual oxidation of the copper surface which lead to bondability and reliability of the bond. A method to monitor the level of oxidation on the wire surface using the electrochemical method is described in this paper. This method can measure copper oxide with thickness as thin as the native oxide and with resolution of 3 Å. This paper describes the apparatus and concept behind the measurement of copper oxides on different wire sizes which are exposed to various temperature and humidity conditions”|
|Vinh Nguyen, VP Business Development