Here is the abstract you requested from the wirebonding_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|New Era in Cu & Ag Alloy Wire Bonding Technology|
|Keywords: Cu and Ag Alloy Wire, Wire Bonding, Bonding|
|Copper (Cu) and Silver (Ag) Alloy wire is the leading preferred method for wire bonding microelectronics devices. synonymous with costs, Cu and Ag Alloy wire has better reliability and circuit performance due to controlled intermetallic growth and excellent electrical conductivity. In this paper, a revolutionary new bonding tool and bonding mechanism was introduced to overcome the challenges in Cu and Ag Alloy bonding. This new bonding tool or mechanism has changed the package adaptability. The new cutting edge bonding tool (transducer), is able to provide excitation energy in both (Y) and (X) axis direction. This breakthrough capability has provided the means of exploring new and simple bonding methodology. The results thus far have been very promising and many formidable challenges previously encountered are conceivable now. Reduction in Al splash, improvement in IMC coverage and decrement in bonding cycle time can be realized. This breakthrough also has the potential in reducing stress between the bonding interface of Cu or Ag Alloy wire and the Al bond pad, leading to better reliability and robustness.|
|Song Keng Yew James,
ASM Pacific Technology Pte. Ltd