Here is the abstract you requested from the wirebonding_2018 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|In-line Oxide Removal and Surface Cleaning Using Openair Plasma|
|Keywords: plasma processing, wire bonding, metal oxide modification|
|Traditional means of oxide remove from metalized surfaces used in micro- electronics, hybrid micro-electronics, and die attach assemblies include wet chemicals and low pressure “batch” plasma technologies. Wet chemicals can be harmful to both people and the environment. Low pressure plasma systems are slow, require batch processing, and are unable to provide localized treatment. This paper presents use of atmospheric (openair) plasma as an alternative (in-line and selective) method for reduction of oxidized metal surfaces and removal of organic contaminates. This paper presents an investigation of chemical and structural changes made through use of atmospheric plasma on copper, gold, aluminum, ENIG, and ENEPIG surfaces. A practical example is shown for applications involving wire bonding, electro-plating, surface cleaning and surface wetting. Surface modifications are achieved by an atmospheric plasma source produced by a non-contact remote arc-like discharge. DC bias exposed to the surfaces is limited to voltages as low as 50 mV. Throughputs of 500 mm²/s has been realized for oxide reduction on copper. Organic cleaning rates have exceeded 2,500 mm²/s.|
|Khoren Sahagian , Chief Process Engineer