Here is the abstract you requested from the dpc_2019 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Cost Comparison of Panel Level and Wafer Level Fan-out Packaging|
|Keywords: panel processing, fan-out wafer level packaging, cost comparison|
|In recent years, the possibility of panels replacing wafers in some fan-out applications has been a topic of interest. Questions of cost and yield continue to arise even as the industry appears to be full steam ahead. While large panels allow for more packages to be produced at once, the cost does not scale simply based on how many more packages can be generated from a panel over a wafer. This analysis begins by breaking down the types of cost and will discuss how those types of cost are impacted (or not) by the shift from wafer to panel. Activity based cost modeling is used; this is a detailed, bottom-up approach that takes into account each type of cost for each activity in a process flow. Two complete cost models were constructed for this analysis. A variety of package sizes are analyzed, and multiple panel sizes are included as well. For each set of activities in the fan-out process flow, there is an explanation of how the process changes with the move to panel, including assumptions related to throughput, equipment price, and materials. The cost reduction that may be achieved at each package and panel size will be presented for each processing segment. The focus of this analysis is on the details of each segment of the process flow, but results for the total cost of various packages will also be presented. There is also a section of analysis related to the impact of yield on the competitiveness of panel processing.|
SavanSys Solutions LLC