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|Quick Prototyping Design for More than Moore era|
|Keywords: System in Package, Co-design, Fan-out wafer Level Package|
|[Background and Motivation] System in Package (SiP) is pulling the evolution of technology instead of deep submicron of LSI. SiP assists coming AI/IoT/5G world. SiP has many implementation variations. When we examine the chip and package implementation technique for the target product, it's important task to find the optimal solution for the product considering trade-off between cost and performance. Compared with mass production products, it's important to optimize costs especially for small volume production products. Moreover, in terms of performance, compared to conventional packages, for high frequency products and SiP, since the margin becomes small and confirming system level electrical characteristics are necessary, in addition to conventional conceptual design and detail design, prototyping design is required to test its electrical characteristics while keeping lower cost. [Technical callenge] To do prototyping design at the early stage of product and find the optimum solution of the product, we created short turn-around time(TAT) iteration environment and distributed prototyping design. Quick Prototyping, which is a short TAT iteration environment, is based on the LSI/Package/PCB integrated co-design environment, estimates the chip size from the signal number of product, performs LSI design prototyping, using package automatic net assignment and the substrate auto routing, proceeds package prototype design and then confirms electrical characteristics. In the above, it�fs possible to consider multiple implementation variations. In the distribution of prototype design, we utilize the LPB format (IEC 63055/IEEE 2401), have eliminated the interface(I/F) barriers between companies and tools, and have developed an environment for design prototypes and checking their characteristics throughout the industry. [Results and Conclusions] In collaboration with Semiconductor vendor Socionext Inc., as the above benchmark, 3D Flip Chip-Chip Scale Package(FCCSP) (with memory package with Package on Package(PoP) method) and 3D Fan-Out Wafer Level Package(FOWLP) (similarly in PoP method) as samples, the prototype design was created out. By comparison of the electrical characteristics, the Self Inductance of the FOWLP becomes half or less than FCCSP, the power supply noise could be suppressed. The shielding effect of FOWLP reduced the influence of crosstalk. We confirmed that FOWLP has advantage of electrical characteristics. On the cost side, in the LSI implementation of the FOWLP side, only the function blocks requiring performance were replaced with the fine node by chip partitioning, we examined to suppress the increase in cost while maintaining the performance advantage of FOWLP. With Quick Prototyping, cost and performance balance can be examined in the product review early stages, also by utilizing the LPB format for Quick Prototyping, from the negotiation stage with business partners, we can share the design data, focus on tuning the product itself and improve the competitive SiP products.|
|Yoko Fujita, Senior Partner